Leading EDA (Electronic Design Automation) chip design tools bellwether, Synopsys, recently announced a new program for tech startups that could help foster innovation in many markets and industries.

Announces Synopsys.ai customer momentum with applications including DSO.ai and VSO.ai delivering significant improvements in PPA, turn-around time, and more; Drives multi-die design innovation with ...

The Industry's First Multi-Vendor Environment of EDA, IP, and Foundry Solutions on the Synopsys Cloud Platform Significantly Accelerates Chip Development Highlights: Synopsys Cloud OpenLink program ...

Synopsys, Inc. is introducing Synopsys fAST Dynamic, a new application security testing (DAST) offering on the Synopsys Polaris Software Integrity Platform that enables development, security, and ...

Integration of Synopsys virtual electronic control unit (vECU) solutions with Continental’s cloud-based development environment (CAEdge) enables faster advancement for the Software-Defined Vehicle ...

Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. Machine Learning, or what the industry generally refers to as AI, ...

SUNNYVALE, Calif., Sept. 25, 2024 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most ...

As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid escalating design complexity.

MOUNTAIN VIEW, Calif., Oct. 29, 2019 /PRNewswire/ -- Highlights: Ultra-low power DesignWare Die-to-Die PHY IP delivers less than 1pJ/bit for optimal energy efficiency in hyperscale data centers ...

Synopsys Cloud OpenLink program delivers ultimate optionality, allowing designers to efficiently access multi-vendor solutions in the Synopsys Cloud environment. Enables highly secure customer ...