LISLE, Ill. & NEW ALBANY, Ind.--(BUSINESS WIRE)--Two global leaders in the design and manufacture of interconnects for high-performance electronic products today announced a Licensed Source Agreement ...
January 23, 2019 -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will team up with Samtec to demonstrate eSilicon’s 7nm 56G ...
The joint demonstration combines PLDA’s PCIe 4.0 IP solutions and Samtec interconnect to deliver PCIe 4.0 speed without the use of retimers or updated motherboard using MEGTRON 6 technologies, ...
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