Power devices continue to evolve rapidly as SiC and GaN technologies become more highly integrated, easy to use, and cost-effective. Meanwhile, steady improvements in MOSFET structures and processes ...

Power devices continue to evolve rapidly as SiC and GaN technologies become more efficient, integrated, and cost-effective. Meanwhile, steady improvements in MOSFET structures and processes enable ...

The reliability and performance of power electronic devices underpin modern electrical systems across energy, transport and industrial sectors. These devices, such as insulated gate bipolar ...

As the growth in global electricity need and supply continues to accelerate, efficient power electronics will be key to improving grid efficiency, stability, integration, and resilience for all energy ...

Electronic devices can now use six thermistors to protect low-voltage circuits, save board space, and improve power use.

Atomic force microscopy (AFM) shows the surface of the TaC thin film before and after annealing at high temperatures. The initial film surface is composed of many columnar grains, whereas after ...