Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved. But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Nisshinbo Micro Devices Inc. has deployed multiple Cadence ® solutions, including the AI-based ...

This application note describes one of the general categories of Hall-effect IC devices that offers digital output. Omnipolar switches, also known as omnipolar Hall-effect sensor ICs, are a type of ...

On Jan. 3, Synaptics released the SYN4778, a small, low power, accurate GNSS integrated circuit for Internet of Things (IoT) devices. SYN4778 is designed to extend battery life, reduce product size, ...

The AVSP-4412 is a full-duplex 4-channel retimer IC. The AVSP-8801 is a unidirectional 8-channel retimer IC. These devices are part of our Vortex Signal Integrity™ product family leveraging Avago’s ...

SEALSQ Corp (NASDAQ: LAES), ("SEALSQ" or "Company"), a company that focuses on developing and selling Semiconductors, PKI, and Post-Quantum technology hardware and software products, today announced ...

SEALSQ Corp (NASDAQ: LAES) ("SEALSQ” or the "Company”), a leader in semiconductors, public key infrastructure (PKI), and post-quantum technology hardware and software, today announced its ...

The rising complexities of semiconductor processes and design are driving an increasing use of on-chip monitors to support data analytics from an IC’s birth through its end of life — no matter how ...

Not so long ago, defense and aerospace applications were the traditional drivers of advances in electronic packaging technologies, or "the way electronic systems are assembled." At the time, cost was ...

IC design houses have experienced a surge in short lead time IC orders for mass-market devices, including TVs, IT products, and handsets, according to industry sources. Save my User ID and Password ...

The IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. In its recently released Global Wafer ...