AI, Micron and Singapore

Micron to Expand in Singapore with US$7 Billion AI Chip-packaging Facility
Micron Technology (NASDAQ:MU) announced a US$7 billion investment to build a high-bandwidth memory (HBM) chip-packaging facility in Singapore to meet rising global demand for artificial intelligence (AI) technology.
Micron To Build $7 Billion Advanced Chip Facility In Singapore Amid AI Boom
Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for AI chips.
Micron to invest $7bn in Singapore to meet AI-driven memory chip demand
The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.
Singapore slots itself into the HBM supply chain—key to the AI boom—with a $7 billion Micron investment
It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new heights.
Micron to Spend $7 Billion Building Singapore Memory Chip Plant
Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore, as artificial intelligence boosts demand for advanced memory chips.
Micron's $7 Billion Bet on AI-Driven Memory In Singapore Facility Set to Boost Innovation
Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM advanced packaging facility,
Micron’s $9.5b chip plant to give Singapore foothold in AI space; will create up to 3,000 jobs
Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at straitstimes.com.
Micron's $9.5b chip plant in Woodlands to drive Singapore's AI growth, create up to 3,000 jobs
Singapore can be expected to play a larger role in developing complex artificial intelligence (AI) applications when Micron's new $9.5 billion high bandwidth memory (HBM) advanced packaging facility in Woodlands becomes operational in 2026.
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth.
Micron invests $7 billion in HBM assembly facility amid AI boom
Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in Singapore. The company will invest $7 billion in the plant, as it expects demand for HBM3E,
Micron breaks ground on $7B HBM packaging facility in Singapore
Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.
Business Times2d
Micron invests US$7 billion in Woodlands advanced packaging site; 1,400 jobs to be created
MICRON Technology on Wednesday (Jan 8) broke ground in Woodlands for an advanced packaging facility for its high-bandwidth memory (HBM) semiconductor chip. Read more at The Business Times.
The Edge Singapore1d
Micron to spend US$7 billion building Singapore memory chip plant
Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...